Description
DESCRIPTION The PELCO® FIB Lift-Out Half Grid is made of stiff copper beryllium with a thickness of 100µm (0.004″). Has two dots on one side for easy identification. Diameter 3mm with a height of 1.5mm. Slot is 2mm wide x 0.5mm deep. This robust half grid offers easy handling and good protection for the TEM lamellas. PELCO® Half Grids for FIB Applications, vial/25 PELCO® FIB Lift-Out TEM Grids – Available in Cu, Mo and Si The PELCO® FIB Lift-Out TEM Grids have been designed for in-situ lift to attach the TEM lamellas milled out by SEM/FIB or FIB systems. The design has been optimized for access and flexibility. The nominal diameter of the sturdy PELCO® FIB Lift-Out Grids is 3mm. These grids fit an all standard TEM holders and provide a full view of the thin section attached to the posts.
